This paper presents a method of electrically determining the permeability ofpatterned, electroplated ferromagnetic alloys and brings together thesimultaneous wafer mapping of relative permeability, electrical resistivity andmechanical strain of these electrodeposited films, as well as the layerthickness and alloy composition. The wafer mapping of all these properties isimplemented using a set of simple, automated electrical and optical techniquesthat facilitate the quantification of the spatial correlation between differentparameters. This enables the uniformity of conductive ferromagnetic films to beanalysed and supports the optimization of the physical properties of thesematerials as well as the processes used to deposit them.
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